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Tentative Schedule
08.00 AM: Registration
09:00 AM: Welcome Address
09:05 AM: About the Workshop
09:15 AM: Director's Address
09:30 AM: MEMS Overview
09:45 AM: Wafer Dicing & Wire bonding processes
10:15 AM: Wafer Bonding & Critical Point drying
processes
10:40 AM: Tea Break
11:00 AM: Flip Chip Bonding technology
11:15 AM: Mechanical Characterization - Bond Tester
11:30 AM: Electrical Characterization - Probe Station and Impedance Analyser
11:45 AM: Electron Beam Welding, Seam Sealing
and Helium Leak Detector
12:15 PM: X-Ray Inspection System
12:30 PM: Photo Lithography
12:40 PM: Nano Imprint Lithography (UV & Hot Embossing)
12:50 PM: Electroplating System
01:00 PM: Lunch Break
02:00 PM: Vendor's Presentation
02:30 PM: Lab Visit
04.00 PM: Tea Break
04:15 PM: Participant's Feedback
04:30 PM: Closing Remarks and Vote of Thanks
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